Invention Application
- Patent Title: SUBSTRATE PROCESSING SYSTEM
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Application No.: US15128804Application Date: 2015-02-27
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Publication No.: US20170110349A1Publication Date: 2017-04-20
- Inventor: Yutaka FUJINO
- Applicant: TOKYO ELECTRON LIMITED
- Priority: JP2014-073450 20140331
- International Application: PCT/JP2015/055818 WO 20150227
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01L21/683 ; H01L21/52 ; H01L21/677
Abstract:
A substrate processing system for performing a process with respect to a plurality of substrates includes an annular process chamber configured to accommodate the plurality of substrates and to perform a predetermined process on the plurality of substrates, a cassette mounting part configured to mount a cassette which accommodates the plurality of substrates, and a substrate transfer mechanism configured to transfer the plurality of substrates between the annular process chamber and the cassette mounting part. The plurality of substrates is concentrically disposed within the annular process chamber in a plane view.
Public/Granted literature
- US10170347B2 Substrate processing system Public/Granted day:2019-01-01
Information query
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