A sealing system for sealing an electronics housing includes, in one example, a one-piece sealing member that seals the perimeter surface of an electronics substrate disposed within the electronics housing. The one-piece sealing member includes a perimeter seal portion that engages the perimeter substrate, a first seal portion that engages a first substrate surface and a second seal portion that engages a second substrate surface of the electronics substrate. The one-piece sealing member also includes a pocket that engages and seals an input and output component adjacent to the electronics substrate, such as an audio connector or Universal Serial Bus connector. The perimeter seal portion of the one-piece sealing member may also include a translucent section that allows light from a light emitting diode to be emitted through the one-piece sealing member.