An inductor device includes a first insulating layer having a first via hole, a first metal layer formed on an upper surface of the first insulating layer and having a droop portion at an upper end-side of the first via hole, a second metal layer formed on a lower surface of the first insulating layer and having a first connection part exposed to a bottom surface of the first via hole, and a first metal-plated layer formed in the first via hole and configured to connect the first connection part and the droop portion of the first metal layer.