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公开(公告)号：US11103185B2
公开(公告)日：2021-08-31
申请号：US16541558
申请日：2019-08-15
发明人： Tatsuaki Denda
摘要： A semiconductor device includes an antenna mounted on a wiring substrate. A holding member includes a first plate-shaped part having a first surface and a second surface, a second plate-shaped part having a third surface and a fourth surface, and a coupling part configured to couple the first plate-shaped part and the second plate-shaped part so that the second surface and the third surface have parts facing each other with a space therebetween. The one end of the wiring substrate is fixed to the holding member so that the antenna overlaps the coupling part, as seen from above. A part continuing to the one end of the wiring substrate is folded back so as to being arranged sequentially along the first surface, the second surface, the third surface, and the fourth surface. The other end of the wiring substrate extends in an elastically deformable state from the fourth surface.
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公开(公告)号：US11495715B2
公开(公告)日：2022-11-08
申请号：US17094668
申请日：2020-11-10
发明人： Tatsuaki Denda
IPC分类号： H01L33/48 , H01L33/62 , H01L31/02 , H01L31/173 , A61B5/145 , A61B5/00 , A61B5/1455 , H01L25/16
摘要： An electronic device includes: a support body including first and second planar portions facing each other, a first connecting portion connecting the first and second planar portions, and a first receptacle surrounded by the first and second planar portions and the first connecting portion; a projection being part of the second planar portion projecting outward from the first receptacle outside the first planar portion in plan view; a wiring substrate including a facing surface facing the support body and an opposite surface opposite to the facing surface, the wiring substrate being folded and attached along an inner surface of the first receptacle and a surface of the projection continuous with the inner surface of the first receptacle; a sensor element mounted on the facing surface attached to the inner surface of the first receptacle; and an antenna mounted on the opposite surface attached to the surface of the projection.
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公开(公告)号：US20170117219A1
公开(公告)日：2017-04-27
申请号：US15332611
申请日：2016-10-24
IPC分类号： H01L23/522 , H01L23/528
CPC分类号： H01L23/5227 , H01F17/0013 , H01F2017/002 , H01L23/5226 , H01L23/5283
摘要： An inductor device includes a first insulating layer having a first via hole, a first metal layer formed on an upper surface of the first insulating layer and having a droop portion at an upper end-side of the first via hole, a second metal layer formed on a lower surface of the first insulating layer and having a first connection part exposed to a bottom surface of the first via hole, and a first metal-plated layer formed in the first via hole and configured to connect the first connection part and the droop portion of the first metal layer.
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公开(公告)号：US20230164908A1
公开(公告)日：2023-05-25
申请号：US17992078
申请日：2022-11-22
发明人： Tatsuaki Denda , Takehito Terasawa
CPC分类号： H05K1/0224 , H05K1/0393 , H05K2201/2081
摘要： A wiring board includes a plurality of insulating layers each being made of flexible insulating resin, and a conductor layer that is laminated on the plurality of insulating layers and that has a conductor pattern. The conductor layer includes a conductor pattern that has a certain shape in which a plurality of unit patterns are connected in plan view. The unit pattern includes a U-shaped pattern, an inverted U-shaped pattern that is arranged such that an opening side is located away from an opening side of the U-shaped pattern, and a straight line pattern that connects center portions of the U-shaped pattern and the inverted U-shaped pattern.
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公开(公告)号：US11530983B2
公开(公告)日：2022-12-20
申请号：US17341646
申请日：2021-06-08
发明人： Tatsuaki Denda , Yuji Furuta
IPC分类号： G01N21/3504 , G01N33/497 , G02B5/20
摘要： A sensor module for measuring a concentration of a gas by utilizing changes in an amount of absorbed light includes a light emitting device and a light receiving device configured to receive light emitted by the light emitting device, wherein the light emitting device and the light receiving device are disposed to face each other across a gap, wherein the light emitting device and the light receiving device are positioned such as to be exposed to the gas, and the gap forms part of a flow pathway of the gas, and wherein the gap is greater than or equal to 0.2 mm and less than or equal to 1.0 mm.
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公开(公告)号：US09899310B2
公开(公告)日：2018-02-20
申请号：US15293464
申请日：2016-10-14
发明人： Tatsuaki Denda
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/563 , H01L23/3185 , H01L23/49822 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L2224/131 , H01L2224/16157 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81444 , H01L2224/81815 , H01L2224/92125 , H01L2924/07025 , H01L2924/15747 , H01L2924/1579 , H01L2924/2064 , H05K3/005 , H05K3/3436 , H05K3/4007 , H05K3/427 , H01L2924/00014 , H01L2924/014
摘要： A wiring substrate includes an insulating layer, at least one via hole formed in the insulating layer, a first wiring layer formed on one surface of the insulating layer and having a droop portion at an end-side of the via hole, a second wiring layer formed on the other surface of the insulating layer, and a metal-plated layer formed in the via hole and configured to connect the second wiring layer and the droop portion of the first wiring layer. One surface of the insulating layer around the via hole is formed as a convex curved surface and the droop portion of the first wiring layer is arranged on the convex curved surface.
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公开(公告)号：US20170374732A1
公开(公告)日：2017-12-28
申请号：US15627537
申请日：2017-06-20
发明人： Tatsuaki Denda
CPC分类号： H05K1/028 , H05K1/115 , H05K1/118 , H05K1/147 , H05K1/189 , H05K3/0064 , H05K3/06 , H05K3/361 , H05K3/423 , H05K3/429 , H05K3/4623 , H05K3/4644 , H05K3/4691 , H05K2201/068
摘要： A circuit board includes a rigid board including a first wiring layer formed on its upper surface side, and a flexible board including a base material having flexibility and disposed on an upper surface side of the first wiring layer, a second wiring layer formed on the base material, and a via wiring formed in a through-hole passing through the second wiring layer and the base material. The via wiring has a protrusion protruding from an upper surface of the second wiring layer, and extending on the upper surface of the second wiring layer positioned on an outer circumferential side of the through-hole.
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8.发明授权公开(公告)号：US08952408B2
公开(公告)日：2015-02-10
申请号：US13710648
申请日：2012-12-11
发明人： Tatsuaki Denda , Kazutaka Kobayashi
CPC分类号： H01L33/60 , H01L21/50 , H01L2224/16245 , H01L2924/181 , H05K1/0203 , H05K1/0265 , H05K1/0274 , H05K1/111 , H05K2201/09409 , H05K2201/098 , H05K2201/099 , H05K2201/10106 , H05K2201/2054 , H01L2924/00012
摘要： A light-emitting element mounting package includes a light-emitting element mounting portion that includes a plurality of wiring portions arranged interposing a predetermined gap between the wiring portions facing each other, and an insulating layer on which the light-emitting element mounting portion is mounted, wherein an upper surface of the light-emitting element mounting portion is exposed on the insulating layer, wherein cutout portions are formed on lower sides of side edges of the wiring portions and contact the insulating layer.
摘要翻译： 发光元件安装封装包括发光元件安装部分，该发光元件安装部分包括布置在彼此面对的布线部之间的预定间隙的多个布线部分和安装有发光元件安装部分的绝缘层 其中，所述发光元件安装部的上表面露出在所述绝缘层上，在所述布线部的侧缘的下侧形成有切口部，并与所述绝缘层接触。
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公开(公告)号：US20210151634A1
公开(公告)日：2021-05-20
申请号：US17094668
申请日：2020-11-10
发明人： Tatsuaki Denda
摘要： An electronic device includes: a support body including first and second planar portions facing each other, a first connecting portion connecting the first and second planar portions, and a first receptacle surrounded by the first and second planar portions and the first connecting portion; a projection being part of the second planar portion projecting outward from the first receptacle outside the first planar portion in plan view; a wiring substrate including a facing surface facing the support body and an opposite surface opposite to the facing surface, the wiring substrate being folded and attached along an inner surface of the first receptacle and a surface of the projection continuous with the inner surface of the first receptacle; a sensor element mounted on the facing surface attached to the inner surface of the first receptacle; and an antenna mounted on the opposite surface attached to the surface of the projection.
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公开(公告)号：US10219369B2
公开(公告)日：2019-02-26
申请号：US15627537
申请日：2017-06-20
发明人： Tatsuaki Denda
IPC分类号： H05K1/02 , H05K1/11 , H05K1/14 , H05K3/42 , H05K3/46 , H05K3/36 , H05K1/18 , H05K3/06 , H05K3/00
摘要： A circuit board includes a rigid board including a first wiring layer formed on its upper surface side, and a flexible board including a base material having flexibility and disposed on an upper surface side of the first wiring layer, a second wiring layer formed on the base material, and a via wiring formed in a through-hole passing through the second wiring layer and the base material. The via wiring has a protrusion protruding from an upper surface of the second wiring layer, and extending on the upper surface of the second wiring layer positioned on an outer circumferential side of the through-hole.
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