发明申请
- 专利标题: UNMERGED EPITAXIAL PROCESS FOR FINFET DEVICES WITH AGGRESSIVE FIN PITCH SCALING
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申请号: US14920354申请日: 2015-10-22
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公开(公告)号: US20170117274A1公开(公告)日: 2017-04-27
- 发明人: Xiuyu Cai , Kangguo Cheng , Ali Khakifirooz , Ruilong Xie , Tenko Yamashita
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION , GLOBALFOUNDRIES INC.
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/8234 ; H01L29/66
摘要:
Semiconductor devices and methods for making the same includes conformally forming a first spacer on a plurality of fins. A second spacer is conformally formed on the first spacer, the second spacer being formed from a different material from the first spacer. The plurality of fins are etched below a bottom level of the first spacer to form a fin cavity. Material from the first spacer is removed to expand the fin cavity. Fin material is grown directly on the etched plurality of fins to fill the fin cavity.
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