Invention Application
- Patent Title: Interface Module and Related Method
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Application No.: US15403192Application Date: 2017-01-11
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Publication No.: US20170133796A1Publication Date: 2017-05-11
- Inventor: Mao-Lin Wu , Ho-Chung Chen , Chia-Yu Hsieh , Li-Chun Yang
- Applicant: MEDIATEK INC.
- Main IPC: H01R13/6581
- IPC: H01R13/6581 ; H01R13/646

Abstract:
An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.
Public/Granted literature
- US10003160B2 Interface module and related method Public/Granted day:2018-06-19
Information query