Interface Module and Related Method
    1.
    发明申请
    Interface Module and Related Method 审中-公开
    接口模块及相关方法

    公开(公告)号:US20140022719A1

    公开(公告)日:2014-01-23

    申请号:US13661014

    申请日:2012-10-25

    申请人: MEDIATEK INC.

    IPC分类号: G06F1/16 B05D5/12

    CPC分类号: H01R13/6581 H01R13/646

    摘要: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.

    摘要翻译: 公开了一种耦合在主机设备和无线设备之间的接口模块。 接口模块包括连接器,其具有覆盖在具有第一深度的第一壳体中的第一部分和在具有第二深度的第二壳体中覆盖的第二部分; 以及耦合到所述连接器的所述第一部分的控制电路,用于控制所述主机设备和所述无线设备之间的数据传输; 其中所述第二壳体由导电材料制成并且可以被吸收材料进一步覆盖。

    Interface module and related method

    公开(公告)号:US10003160B2

    公开(公告)日:2018-06-19

    申请号:US15403192

    申请日:2017-01-11

    申请人: MEDIATEK INC.

    CPC分类号: H01R13/6581 H01R13/646

    摘要: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.

    Interface Module and Related Method

    公开(公告)号:US20170133796A1

    公开(公告)日:2017-05-11

    申请号:US15403192

    申请日:2017-01-11

    申请人: MEDIATEK INC.

    IPC分类号: H01R13/6581 H01R13/646

    CPC分类号: H01R13/6581 H01R13/646

    摘要: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.