Film for use in preparing a printed circuit board (PCB) along with methods for making a PCB and producing a printable film are described herein. The film includes a first layer formed of a radiation-transparent material, a second layer formed of a curable adhesive material, a third layer formed of an electrically conductive material, and optionally, a fourth layer formed of an adhesive and a fifth layer formed of a removable material. Through the adhesive layers, the layers are bonded together to produce the printable film. To produce a PCB, the first layer is covered in ink distributed in a pattern representing the PCB, and the ink-covered film is exposed to radiation until the non-ink-covered portions of the second layer have cured. Then, the fifth layer is removed tearing away the electrically conductive material associated with the non-ink-covered portions of the second layer producing the PCB.