Invention Application
- Patent Title: SEMICONDUCTOR DEVICE, CORRESPONDING METHODS OF PRODUCTION AND USE AND CORRESPONDING APPARATUS
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Application No.: US15161617Application Date: 2016-05-23
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Publication No.: US20170141019A1Publication Date: 2017-05-18
- Inventor: Alberto Arrigoni , Alberto Da Dalt
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Priority: IT102015000073934 20151118
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L21/78
Abstract:
A semiconductor device includes a quadrilateral package with a first pair of opposed sides and a second pair of opposed sides. Both sides of the first pair of opposed sides are provided with electrical contact leads. Only one side of the second pair of opposed sides is provided with electrical contact leads. The side of the second pair of opposed sides without electrical contact leads is a leadless side. That side is not a molded side of the package, but rather is defined by a cut surface.
Public/Granted literature
- US09698087B2 Semiconductor device, corresponding methods of production and use and corresponding apparatus Public/Granted day:2017-07-04
Information query
IPC分类:
