公开(公告)号：US09698087B2

公开(公告)日：2017-07-04

申请号：US15161617

申请日：2016-05-23

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Arrigoni ,  Alberto Da Dalt

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/78 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/49575 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L25/0655 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device includes a quadrilateral package with a first pair of opposed sides and a second pair of opposed sides. Both sides of the first pair of opposed sides are provided with electrical contact leads. Only one side of the second pair of opposed sides is provided with electrical contact leads. The side of the second pair of opposed sides without electrical contact leads is a leadless side. That side is not a molded side of the package, but rather is defined by a cut surface.

公开(公告)号：US20170140944A1

公开(公告)日：2017-05-18

申请号：US15416546

申请日：2017-01-26

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Arrigoni ,  Alberto Da Dalt

IPC: H01L21/48 ,  H01L21/78 ,  H01L25/065 ,  H01L23/495

CPC classification number: H01L23/49575 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L25/0655 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device includes a quadrilateral package with a first pair of opposed sides and a second pair of opposed sides. Both sides of the first pair of opposed sides are provided with electrical contact leads. Only one side of the second pair of opposed sides is provided with electrical contact leads. The side of the second pair of opposed sides without electrical contact leads is a leadless side. That side is not a molded side of the package, but rather is defined by a cut surface.

公开(公告)号：US09893001B2

公开(公告)日：2018-02-13

申请号：US15416546

申请日：2017-01-26

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Arrigoni ,  Alberto Da Dalt

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49575 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L25/0655 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device includes a quadrilateral package with a first pair of opposed sides and a second pair of opposed sides. Both sides of the first pair of opposed sides are provided with electrical contact leads. Only one side of the second pair of opposed sides is provided with electrical contact leads. The side of the second pair of opposed sides without electrical contact leads is a leadless side. That side is not a molded side of the package, but rather is defined by a cut surface.

公开(公告)号：US20170141019A1

公开(公告)日：2017-05-18

申请号：US15161617

申请日：2016-05-23

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Arrigoni ,  Alberto Da Dalt

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L21/78

CPC classification number: H01L23/49575 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L25/0655 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device includes a quadrilateral package with a first pair of opposed sides and a second pair of opposed sides. Both sides of the first pair of opposed sides are provided with electrical contact leads. Only one side of the second pair of opposed sides is provided with electrical contact leads. The side of the second pair of opposed sides without electrical contact leads is a leadless side. That side is not a molded side of the package, but rather is defined by a cut surface.