Invention Application
- Patent Title: METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER
-
Application No.: US15323521Application Date: 2014-08-07
-
Publication No.: US20170141058A1Publication Date: 2017-05-18
- Inventor: Kevin J. LEE , Ruchir SARASWAT , Uwe ZILLMANN , Nicholas P. COWLEY , Richard J. GOLDMAN
- Applicant: Kevin LEE , Ruchir SARASWAT , Uwe ZILLMANN , Nicholas COWLEY
- International Application: PCT/US2014/050134 WO 20140807
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01F27/28 ; G06F1/16 ; H01L23/64 ; H01L23/522 ; H03H9/64 ; H03H7/42
Abstract:
Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.
Public/Granted literature
- US10290598B2 Method and apparatus for forming backside die planar devices and saw filter Public/Granted day:2019-05-14
Information query
IPC分类:
