Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE, SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
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Application No.: US15424116Application Date: 2017-02-03
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Publication No.: US20170148679A1Publication Date: 2017-05-25
- Inventor: Chang-Fu Lin , Chin-Tsai Yao , Ming-Chin Chuang , Keng-Hung Liu , Fu-Tang Huang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Priority: TW102123429 20130701
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/544
Abstract:
A semiconductor package is disclosed, which includes: a packaging substrate; a semiconductor element disposed on the packaging substrate in a flip-chip manner; a stopping portion formed at edges of the semiconductor element; an insulating layer formed on an active surface of the semiconductor element and the stopping portion; and an encapsulant formed between the packaging substrate and the insulating layer. The insulating layer has a recessed portion formed on the stopping portion and facing the packaging substrate such that during a reliability test, the recessed portion can prevent delamination occurring between the insulating layer and the stopping portion from extending to the active surface of the semiconductor element.
Information query
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