Invention Application
- Patent Title: COIL COMPONENT AND BOARD HAVING THE SAME
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Application No.: US15258382Application Date: 2016-09-07
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Publication No.: US20170150608A1Publication Date: 2017-05-25
- Inventor: Chan YOON , Dong Hwan LEE , Young Ghyu AHN
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2015-0162379 20151119
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01F41/02 ; H01F27/24 ; H01F41/04 ; H05K1/11 ; H01F27/28

Abstract:
A coil component includes a main substrate; a first coil pattern disposed on a first surface of the main substrate; a first insulating layer disposed on one surface of the first coil pattern; a third coil pattern disposed on one surface of the first insulating layer and electrically connected to the first coil pattern; a second coil pattern disposed on a second surface of the main substrate opposing the first surface; a second insulating layer disposed on one surface of the second coil pattern; a fourth coil pattern disposed on one surface of the second insulating layer and electrically connected to the second coil pattern; and a magnetic body in which the first to fourth coil patterns are embedded, and a board having the same.
Public/Granted literature
- US09655247B1 Coil component and board having the same Public/Granted day:2017-05-16
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