Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US15432977Application Date: 2017-02-15
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Publication No.: US20170162700A1Publication Date: 2017-06-08
- Inventor: Shunpei YAMAZAKI , Jun KOYAMA , Masahiro TAKAHASHI , Hideyuki KISHIDA , Akiharu MIYANAGA , Junpei SUGAO , Hideki UOCHI , Yasuo NAKAMURA
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Priority: JP2009-235791 20091009
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H01L29/423 ; H01L29/24 ; H01L29/49

Abstract:
By using a conductive layer including Cu as a long lead wiring, increase in wiring resistance is suppressed. Further, the conductive layer including Cu is provided in such a manner that it does not overlap with the oxide semiconductor layer in which a channel region of a TFT is formed, and is surrounded by insulating layers including silicon nitride, whereby diffusion of Cu can be prevented; thus, a highly reliable semiconductor device can be manufactured. Specifically, a display device which is one embodiment of a semiconductor device can have high display quality and operate stably even when the size or definition thereof is increased.
Public/Granted literature
- US10043915B2 Semiconductor device and method for manufacturing the same Public/Granted day:2018-08-07
Information query
IPC分类: