- 专利标题: THERMOCOMPRESSION BONDING USING PLASMA GAS
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申请号: US14974823申请日: 2015-12-18
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公开(公告)号: US20170179070A1公开(公告)日: 2017-06-22
- 发明人: Donglai David Lu , Jimin Yao , Amrita Mallik , George S. Kostiew , Shawna M. Liff
- 申请人: Donglai David Lu , Jimin Yao , Amrita Mallik , George S. Kostiew , Shawna M. Liff
- 主分类号: H01L23/00
- IPC分类号: H01L23/00
摘要:
Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.
公开/授权文献
- US10297567B2 Thermocompression bonding using plasma gas 公开/授权日:2019-05-21