公开(公告)号：US20170179070A1

公开(公告)日：2017-06-22

申请号：US14974823

申请日：2015-12-18

申请人： Donglai David Lu ,  Jimin Yao ,  Amrita Mallik ,  George S. Kostiew ,  Shawna M. Liff

发明人： Donglai David Lu ,  Jimin Yao ,  Amrita Mallik ,  George S. Kostiew ,  Shawna M. Liff

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/7525 ,  H01L2224/753 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/75981 ,  H01L2224/81013 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00015 ,  H01L2924/01001 ,  H01L2924/01002 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01018 ,  H01L2924/01036 ,  H01L2924/01054 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2924/014

摘要： Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.