- 专利标题: MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
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申请号: US15217165申请日: 2016-07-22
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公开(公告)号: US20170186541A1公开(公告)日: 2017-06-29
- 发明人: Yong Min HONG , Jae Yeol CHOI , Ki Pyo HONG
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权: KR10-2015-0188335 20151229
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/248 ; H01G4/12 ; H01G4/012
摘要:
A multilayer electronic component includes a body, first and second external electrodes, and first and second side parts. The body includes a multilayer structure in which first and second internal electrode patterns are alternately stacked and contains a dielectric material. The first and second side parts are disposed on outer surfaces of the body to face each other. The first and second external electrodes are disposed on outer surfaces of the body to face each other. The first internal electrode patterns are exposed to a third surface and a fifth surface of the body on which the first external electrode and the first side part are disposed, respectively. Additionally, the second internal electrode patterns are exposed to a fourth surface and a sixth surface of the body on which the second external electrode and the second side part are disposed, respectively.
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