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公开(公告)号：US20180122577A1
公开(公告)日：2018-05-03
申请号：US15857452
申请日：2017-12-28
发明人： Yong Min HONG , Ki Pyo HONG
摘要： A multilayer electronic component and a method of manufacturing the same are provided. The multilayer electronic component includes a body including a multilayer structure in which first internal electrode patterns and second internal electrode patterns different from the first internal electrode patterns are alternately stacked and containing a dielectric material. First and second side parts are disposed on respective outer surfaces of a first pair of opposing outer surfaces of the body. First and second external electrodes are disposed on respective outer surfaces of a second pair of opposing outer surfaces of the body, and the first and second external electrodes are electrically connected to the first and second internal electrode patterns, respectively. The first internal electrode patterns are exposed to the outer surfaces of the first pair of outer surfaces of the body on which the first and second side parts are disposed.
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公开(公告)号：US20170186541A1
公开(公告)日：2017-06-29
申请号：US15217165
申请日：2016-07-22
发明人： Yong Min HONG , Jae Yeol CHOI , Ki Pyo HONG
摘要： A multilayer electronic component includes a body, first and second external electrodes, and first and second side parts. The body includes a multilayer structure in which first and second internal electrode patterns are alternately stacked and contains a dielectric material. The first and second side parts are disposed on outer surfaces of the body to face each other. The first and second external electrodes are disposed on outer surfaces of the body to face each other. The first internal electrode patterns are exposed to a third surface and a fifth surface of the body on which the first external electrode and the first side part are disposed, respectively. Additionally, the second internal electrode patterns are exposed to a fourth surface and a sixth surface of the body on which the second external electrode and the second side part are disposed, respectively.
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公开(公告)号：US20170032883A1
公开(公告)日：2017-02-02
申请号：US15094421
申请日：2016-04-08
发明人： Yong Min HONG , Moon Soo PARK , Jong Ho LEE , Min Hee KIM
IPC分类号： H01F27/28 , H01F41/02 , H01F41/04 , H01F27/29 , H01F27/255
CPC分类号： H01F41/046 , H01F17/0013 , H01F17/04 , H01F27/292 , H01F2017/048
摘要： A coil electronic component includes a magnetic body in which first and second coil parts including coil pattern portions having a spiral shape and lead portions connected to end portions of the coil pattern portions are disposed. The lead portions are each exposed to a surface of the magnetic body, and the coil pattern portions are exposed to first and second side surfaces of the magnetic body in the width direction of the magnetic body, and margin parts are disposed to cover the coil pattern portions exposed to the first and second side surfaces of the magnetic body.
摘要翻译： 线圈电子部件包括：磁体，其中设置有包括具有螺旋形状的线圈图案部分的第一和第二线圈部分和连接到线圈图案部分的端部的引线部分。 引线部分分别暴露于磁体的表面，并且线圈图案部分在磁体的宽度方向上暴露于磁体的第一和第二侧表面，并且边缘部分设置成覆盖线圈图案 暴露于磁体的第一和第二侧表面的部分。
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公开(公告)号：US20240203651A1
公开(公告)日：2024-06-20
申请号：US18137500
申请日：2023-04-21
发明人： Yong PARK , Jong Ho LEE , Jung Jin PARK , Su Min KIM , Eun Jung LEE , Yong Min HONG , Ji Hyeon LEE , Sim Chung KANG , Min Woo KIM , Jung Tae PARK
CPC分类号： H01G4/1227 , H01G4/30
摘要： A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body. The dielectric layer includes N-doped polydopamine.
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5.发明公开公开(公告)号：US20240145173A1
公开(公告)日：2024-05-02
申请号：US18205104
申请日：2023-06-02
发明人： Ji Hyeon LEE , Jong Ho LEE , Eun Jung LEE , Yong Min HONG , Yong PARK , Min Woo KIM , Jung Tae PARK , Sun Mi KIM , Sim Chung KANG
摘要： A method of manufacturing a multilayer electronic component, the method includes, attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in the third direction, an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator.
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公开(公告)号：US20240355548A1
公开(公告)日：2024-10-24
申请号：US18432474
申请日：2024-02-05
发明人： Yong PARK , Min Woo KIM , Jong Ho LEE , Eun Jung LEE , Yong Min HONG , Yong Ung LEE , Jung Tae PARK
摘要： In an example embodiment of the present disclosure, an average distance in the first direction from the active-cover boundary to an end of the side margin portion in the first direction closest to the active-cover boundary among ends of the side margin portion in the first direction is defined as A1, and an average distance in the third direction from the first body-side margin boundary to an end of the side margin portion in the third direction closest to the first body-side margin boundary among ends of the side margin portion in the third direction is defined as A2, and then, A1/A2 is adjusted.
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公开(公告)号：US20180122576A1
公开(公告)日：2018-05-03
申请号：US15855540
申请日：2017-12-27
发明人： Yong Min HONG , Jae Yeol CHOI , Ki Pyo HONG
摘要： A multilayer electronic component includes a body, first and second external electrodes, and first and second side parts. The body includes a multilayer structure in which first and second internal electrode patterns are alternately stacked and contains a dielectric material. The first and second side parts are disposed on outer surfaces of the body to face each other. The first and second external electrodes are disposed on outer surfaces of the body to face each other. The first internal electrode patterns are exposed to a third surface and a fifth surface of the body on which the first external electrode and the first side part are disposed, respectively. Additionally, the second internal electrode patterns are exposed to a fourth surface and a sixth surface of the body on which the second external electrode and the second side part are disposed, respectively.
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公开(公告)号：US20240112864A1
公开(公告)日：2024-04-04
申请号：US18219854
申请日：2023-07-10
发明人： Yong PARK , Jung Tae PARK , Jong Ho LEE , Eun Jung LEE , Yong Min HONG , Jung Jin PARK , Rak Hyeon BAEK , Sun Mi KIM , Yong Ung LEE
IPC分类号： H01G4/30
CPC分类号： H01G4/30
摘要： A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.
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公开(公告)号：US20170186540A1
公开(公告)日：2017-06-29
申请号：US15216151
申请日：2016-07-21
发明人： Yong Min HONG , Ki Pyo HONG
摘要： A multilayer electronic component and a method of manufacturing the same are provided. The multilayer electronic component includes a body including a multilayer structure in which first internal electrode patterns and second internal electrode patterns different from the first internal electrode patterns are alternately stacked and containing a dielectric material. First and second side parts are disposed on respective outer surfaces of a first pair of opposing outer surfaces of the body. First and second external electrodes are disposed on respective outer surfaces of a second pair of opposing outer surfaces of the body, and the first and second external electrodes are electrically connected to the first and second internal electrode patterns, respectively. The first internal electrode patterns are exposed to the outer surfaces of the first pair of outer surfaces of the body on which the first and second side parts are disposed.
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公开(公告)号：US20160293319A1
公开(公告)日：2016-10-06
申请号：US15002140
申请日：2016-01-20
发明人： Yong Min HONG , Jong Ho LEE , Moon Soo PARK
CPC分类号： H01F1/06 , H01F17/0013 , H01F17/04 , H01F27/255 , H01F41/0246 , H01F2017/048
摘要： A coil electronic component includes a coil part, a magnetic body enclosing a core part formed in the coil part, and a ferrite oxide structure disposed in the core part.
摘要翻译： 线圈电子部件包括线圈部分，包围形成在线圈部分中的芯部的磁体和设置在芯部中的铁氧体氧化物结构。
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