Invention Application
- Patent Title: THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
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Application No.: US15432188Application Date: 2017-02-14
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Publication No.: US20170190909A1Publication Date: 2017-07-06
- Inventor: Kazunori Saegusa
- Applicant: Kaneka Corporation
- Applicant Address: JP Osaka
- Assignee: Kaneka Corporation
- Current Assignee: Kaneka Corporation
- Current Assignee Address: JP Osaka
- Priority: JP2014-165226 20140814; JP2015-066490 20150327
- Main IPC: C08L69/00
- IPC: C08L69/00 ; C08L67/02 ; B05D3/02 ; B29C45/00 ; B05D1/00 ; B05D7/02

Abstract:
A resin composition includes 5 to 82 parts by weight of an aromatic polyester, 0 to 50 parts by weight of an aromatic polycarbonate, 10 to 90 parts by weight of a highly heat-resistant aromatic polycarbonate, 0 to 10 parts by weight of a graft-copolymer, 0 to 10 parts by weight of an ethylene copolymer, 2.5 to 50 parts by weight of a silicate filler, 0 to 10 parts by weight of an electric conductive filler, and 0 to 2 parts by weight of a phosphorus compound wherein the total amount of the components are 100 parts by weight. The total amount of the graft-copolymer and the ethylene copolymer is from 0.5 to 10 parts by weight, the silicate filler is at least one compound selected from mica and kaolin, and the resin composition has a deflection temperature under load of 130° C. or higher.
Public/Granted literature
- US10745553B2 Thermoplastic resin composition and molded article thereof Public/Granted day:2020-08-18
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