Invention Application
- Patent Title: MANUFACTURE OF WAFER - PANEL DIE PACKAGE ASSEMBLY TECHNOLOGY
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Application No.: US15490377Application Date: 2017-04-18
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Publication No.: US20170221872A1Publication Date: 2017-08-03
- Inventor: Bing Dang , John Knickerbocker
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L21/66 ; H01L21/78 ; H01L25/18 ; H01L25/16 ; H01L23/00 ; H01L21/683 ; H01L21/56
Abstract:
Disclosed is a process, structure, equipment and apparatus directed to a low cost, high volume approach for the assembly of ultra small die to three-dimensional (3D) or 2.5D semiconductor packages.
Public/Granted literature
- US09893047B2 Manufacture of wafer—panel die package assembly technology Public/Granted day:2018-02-13
Information query
IPC分类:
