Invention Application
- Patent Title: ALTERNATIVE GROUND LINES FOR INTER-SLOT GROUNDING
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Application No.: US15502588Application Date: 2014-08-18
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Publication No.: US20170225462A1Publication Date: 2017-08-10
- Inventor: Boon Bing Ng , Thida Ma Win , Jose Jehrome Rando
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2014/051512 WO 20140818
- Main IPC: B41J2/14
- IPC: B41J2/14 ; H01L23/522 ; H01L23/00 ; H01L23/528

Abstract:
In an example implementation, a grounding structure includes a perimeter ground line around the perimeter of a printhead die, and having north, south, east, and west segments. The structure includes an inter-slot ground line extending from the north segment to the south segment between two fluid slots, and an alternative ground line extending from the east segment to the west segment and intersecting the inter-slot ground line in a connection area near ends of the fluid slots.
Public/Granted literature
- US09975335B2 Alternative ground lines for inter-slot grounding Public/Granted day:2018-05-22
Information query
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