- 专利标题： CONDUCTIVE COMPOSITION AND ELECTRONIC PARTS USING THE SAME
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申请号： US15519719申请日： 2015-10-22
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公开(公告)号： US20170243849A1公开(公告)日： 2017-08-24
- 发明人: Koji SASAKI , Noritsuka MIZUMURA
- 申请人： NAMICS CORPORATION
- 申请人地址： CN Niigata-shi, Niigata
- 专利权人： NAMICS CORPORATION
- 当前专利权人： NAMICS CORPORATION
- 当前专利权人地址： CN Niigata-shi, Niigata
- 优先权： JP2014-217822 20141024
- 国际申请： PCT/JP2015/079774 WO 20151022
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; C08K3/08 ; H01B1/22 ; C09J167/00 ; C09J11/06 ; C09J9/02 ; C08L67/00
摘要：
A conductive composition, which can form bonded portions and is capable of maintaining a thickness of the bonded portions and bonding strength, and which includes: (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent, and (C) thermoplastic resin particles having a maximal value of an endothermic peak in a DSC chart, determined by a measurement using a differential scanning calorimeter, within a range of 80° C. to 170° C.
公开/授权文献
- US10541222B2 Conductive composition and electronic parts using the same 公开/授权日：2020-01-21
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