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公开(公告)号:US11634615B2
公开(公告)日:2023-04-25
申请号:US16614351
申请日:2018-05-18
申请人: NAMICS CORPORATION
发明人: Fuminori Arai , Kazuki Iwaya
摘要: A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.
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公开(公告)号:US11623813B2
公开(公告)日:2023-04-11
申请号:US17435198
申请日:2020-02-06
申请人: NAMICS CORPORATION
发明人: Hiroki Myodo , Masaaki Hoshiyama
IPC分类号: B65D83/00
摘要: There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.
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公开(公告)号:US20230013549A1
公开(公告)日:2023-01-19
申请号:US17782211
申请日:2020-09-25
申请人: NAMICS CORPORATION
IPC分类号: H01C7/10 , H01C7/102 , H01C17/065
摘要: Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).
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公开(公告)号:US20220144531A1
公开(公告)日:2022-05-12
申请号:US17435198
申请日:2020-02-06
申请人: NAMICS CORPORATION
发明人: Hiroki MYODO , Masaaki HOSHIYAMA
IPC分类号: B65D83/00
摘要: There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.
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公开(公告)号:US10550131B2
公开(公告)日:2020-02-04
申请号:US15556450
申请日:2016-03-10
发明人: Akikazu Matsuda , Naoto Okumura , Takeshi Kumano
IPC分类号: C09J163/00 , C08L63/00 , C07D487/04 , C07D519/00 , C08G59/66 , C08G59/50 , C08K5/17
摘要: The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.
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公开(公告)号:US20180358484A1
公开(公告)日:2018-12-13
申请号:US15579815
申请日:2016-06-03
申请人: NAMICS CORPORATION
发明人: Seiya KONNO
IPC分类号: H01L31/0224 , C03C8/18 , H01B1/22 , H01L21/288 , H01L31/0272
摘要: An electro-conductive paste which includes an electro-conductive powder, a multiple oxide containing tellurium oxide, and an organic vehicle. The electro-conductive paste contains 0.1 parts by weight to 10 parts by weight of the multiple oxide based on 100 parts by weight of the electro-conductive powder, and the content ratio of the tellurium oxide in 100% by weight of the multiple oxide as TeO2 is 3% by weight to 30% by weight.
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公开(公告)号:US09795040B2
公开(公告)日:2017-10-17
申请号:US15130167
申请日:2016-04-15
申请人: Namics Corporation
发明人: Jen-Chieh Wei , Zhiming Liu , Steven Z. Shi , Werner G. Kuhr
CPC分类号: H05K3/385 , H05K1/09 , H05K3/389 , H05K3/4652 , H05K2203/1157 , Y10T156/10
摘要: Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.
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公开(公告)号:US09793573B2
公开(公告)日:2017-10-17
申请号:US14127065
申请日:2012-05-31
申请人: Mamoru Baba , Takayuki Fujita
发明人: Mamoru Baba , Takayuki Fujita
IPC分类号: H01M4/58 , H01M10/04 , H01M4/505 , H01M10/0525 , H01M10/0585 , H01M2/20
CPC分类号: H01M10/0436 , H01M2/202 , H01M4/505 , H01M10/0525 , H01M10/0585 , Y02E60/122 , Y02P70/54
摘要: A lithium ion secondary battery that can be charged without regard to polarity is disclosed. The lithium ion secondary battery includes a lithium ion secondary battery unit, which includes a first electrode layer and a second electrode layer that are laminated on an electrolytic region. The first electrode layer and the second electrode layer contain Li2Mn2O4 as a common active material.
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公开(公告)号:US20170243849A1
公开(公告)日:2017-08-24
申请号:US15519719
申请日:2015-10-22
申请人: NAMICS CORPORATION
发明人: Koji SASAKI , Noritsuka MIZUMURA
摘要: A conductive composition, which can form bonded portions and is capable of maintaining a thickness of the bonded portions and bonding strength, and which includes: (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent, and (C) thermoplastic resin particles having a maximal value of an endothermic peak in a DSC chart, determined by a measurement using a differential scanning calorimeter, within a range of 80° C. to 170° C.
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公开(公告)号:US09574091B2
公开(公告)日:2017-02-21
申请号:US14436565
申请日:2013-10-18
申请人: NAMICS CORPORATION
发明人: Yoshiaki Yoshii
IPC分类号: H01B1/20 , H01B1/22 , C09D5/24 , C09D7/12 , C09D201/00 , H05K1/09 , H01B1/16 , H05K1/18 , H05K3/10
CPC分类号: C09D5/24 , C09D7/40 , C09D201/00 , H01B1/16 , H01B1/22 , H05K1/092 , H05K1/18 , H05K3/10 , H05K2201/032 , H05K2203/1126 , H05K2203/12
摘要: A conductive paste including: (A) a silver powder; (B) a glass frit; (C) an organic binder; and (D) a powder containing copper, tin, and manganese.
摘要翻译: 导电浆料,包括:(A)银粉; (B)玻璃料; (C)有机粘合剂; 和(D)含有铜,锡和锰的粉末。
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