Invention Application
- Patent Title: Ejector Heat Pump
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Application No.: US15592768Application Date: 2017-05-11
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Publication No.: US20170248350A1Publication Date: 2017-08-31
- Inventor: Hongsheng Liu , Parmesh Verma , Thomas D. Radcliff
- Applicant: Carrier Corporation
- Applicant Address: US FL Jupiter
- Assignee: Carrier Corporation
- Current Assignee: Carrier Corporation
- Current Assignee Address: US FL Jupiter
- Priority: CN201510383148.2 20150703
- Main IPC: F25B13/00
- IPC: F25B13/00 ; F25B41/04

Abstract:
A vapor compression system (200; 400; 600; 700; 800; 900; 1000) comprises a plurality of valves (260, 262, 264; 260) controllable to define a first mode flowpath and a second mode flowpath. The first mode flowpath is sequentially through: a compressor (22); a first heat exchanger (30); a first nozzle (228; 624); and a separator (48), and then branching into: a first branch returning to the compressor; and a second branch passing through an expansion device (70) and a second heat exchanger (64) to the rejoin the flowpath between the first heat exchanger and the separator. The second mode flowpath is sequentially through: the compressor; the second heat exchanger; a second nozzle (248; 625); and the separator, and then branching into: a first branch returning to the compressor; and a second branch passing through the expansion device and first heat exchanger to the rejoin the flowpath between the first heat exchanger and the separator.
Public/Granted literature
- US10914496B2 Ejector heat pump Public/Granted day:2021-02-09
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