Invention Application
- Patent Title: FIN FIELD EFFECT TRANSISTOR AND METHOD FOR FABRICATING THE SAME
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Application No.: US15054133Application Date: 2016-02-26
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Publication No.: US20170250282A1Publication Date: 2017-08-31
- Inventor: Cheng-Ta Wu , Yu-Ting Lin , Po-Kai Hsiao , Po-Kang Ho , Ting-Chun Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8234 ; H01L27/088

Abstract:
A FinFET including a substrate, a plurality of isolation structures, a plurality of blocking layers, and a gate stack is provided. The substrate has a plurality of semiconductor fins. The isolation structures are located on the substrate to isolate the semiconductor fins. In addition, the semiconductor fins protrude from the isolation structures. The blocking layers are located between the isolation structures and the semiconductor fins. The material of the blocking layers is different from the material of the isolation structures. The gate stack is disposed across portions of the semiconductor fins, portions of the blocking layers and portions of the isolation structures. In addition, a method for fabricating the FinFET is also provided.
Public/Granted literature
- US09893185B2 Fin field effect transistor and method for fabricating the same Public/Granted day:2018-02-13
Information query
IPC分类: