A roll-to-roll electroless plating system including a reservoir containing a plating solution. A web advance system advances a web of substrate though the plating solution in the reservoir along a web advance direction, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of substrate. A pump circulates plating solution from an output of the reservoir to an inlet of the reservoir located below the web of substrate. A spreader duct includes a channel that is in fluidic communication with the inlet of the reservoir, wherein the channel is positioned below the web of substrate and includes at least one outlet disposed beyond the first edge or the second edge of the web of substrate and has no outlets disposed immediately below the web of substrate.