Invention Application
- Patent Title: METHOD OF ARRANGING TREATMENT PROCESS
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Application No.: US15450876Application Date: 2017-03-06
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Publication No.: US20170261258A1Publication Date: 2017-09-14
- Inventor: Jun HIROSE , Norihiko AMIKURA , Risako MIYOSHI
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP2016-047051 20160310
- Main IPC: F26B3/04
- IPC: F26B3/04

Abstract:
A method includes a step of increasing or decreasing a flow rate of a gas of the a second gas supply system, by a predetermined time from a start of a gas treatment step of the process recipe or a by a predetermined time before a start of the gas treatment step, by using apparatus information regarding a first gas supply system of the first substrate treatment apparatus and the second gas supply system of the second substrate treatment apparatus, and arranging the treatment process, and in this step, the treatment process of the second substrate treatment apparatus performed using the process recipe conforms to the treatment process of the first substrate treatment apparatus performed using the process recipe.
Information query
IPC分类: