Invention Application
- Patent Title: SEALANT AND PREPARATION METHOD THEREOF, AND DISPLAY PANEL MOTHERBOARD AND MANUFACTURING METHOD THEREOF
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Application No.: US15310149Application Date: 2016-02-19
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Publication No.: US20170265310A1Publication Date: 2017-09-14
- Inventor: Hongpeng Li
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Priority: CN201510629709.2 20150928
- International Application: PCT/CN2016/074117 WO 20160219
- Main IPC: H05K3/38
- IPC: H05K3/38 ; H05K3/22 ; H05K1/14 ; H05K1/03 ; C09J4/06 ; C09J11/08

Abstract:
A sealant and a preparation method thereof, a display panel motherboard and a manufacturing method thereof are disclosed. The sealant includes a main adhesive material and a water swellable material dispersed and doped in the main adhesive material. The sealant and the preparation method thereof, the display panel motherboard and the manufacturing method thereof are capable of solving a problem of a notch formed in a sealant where a etchant flows into the display panel unit when the display panel mother board is subjected to a thinning treatment.
Public/Granted literature
- US10219392B2 Sealant and preparation method thereof, and display panel motherboard and manufacturing method thereof Public/Granted day:2019-02-26
Information query