Invention Application
- Patent Title: PIEZOELECTRIC PACKAGE-INTEGRATED DELAY LINES
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Application No.: US15088830Application Date: 2016-04-01
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Publication No.: US20170288639A1Publication Date: 2017-10-05
- Inventor: Adel A. ELSHERBINI , Feras EID , Baris BICEN , Telesphor KAMGAING , Vijay K. NAIR , Georgios C. DOGIAMIS , Johanna M. SWAN , Valluri R. RAO
- Applicant: Intel Corporation
- Main IPC: H03H9/30
- IPC: H03H9/30 ; H03H9/13

Abstract:
Embodiments of the invention include a waveguide structure that includes a first piezoelectric transducer that is positioned in proximity to a first end of a cavity of an organic substrate. The first piezoelectric transducer receives an input electrical signal and generates an acoustic wave to be transmitted with a transmission medium. A second piezoelectric transducer is positioned in proximity to a second end of the cavity. The second piezoelectric transducer receives the acoustic wave from the transmission medium and generates an output electrical signal.
Public/Granted literature
- US10594294B2 Piezoelectric package-integrated delay lines Public/Granted day:2020-03-17
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