公开(公告)号：US20220246554A1

公开(公告)日：2022-08-04

申请号：US17721241

申请日：2022-04-14

申请人： Intel Corporation

发明人： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Javier A. FALCON ,  Shawna M. LIFF ,  Yoshihiro TOMITA

IPC分类号： H01L23/66 ,  H01L23/48 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L25/10 ,  H01L25/16

摘要： Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20200235716A1

公开(公告)日：2020-07-23

申请号：US16648121

申请日：2017-12-28

申请人： Intel Corporation

发明人： Feras EID ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Johanna M. SWAN

IPC分类号： H03H9/10 ,  H03H9/05 ,  H03H9/54

摘要： Packaged RF front end systems including a hybrid filter and an active circuit in a single package are described. In an example, a package includes an active die comprising an acoustic wave resonator. A package substrate is electrically coupled to the active die. A seal frame surrounds the acoustic wave resonator and is attached to the active die and to the package substrate, the seal frame hermetically sealing the acoustic wave resonator in a cavity between the active die and the package substrate.

公开(公告)号：US20200075501A1

公开(公告)日：2020-03-05

申请号：US16070507

申请日：2016-03-31

申请人： Intel Corporation

发明人： Digvijay A. RAORANE ,  Vijay K. NAIR

IPC分类号： H01L23/552 ,  H01L23/13 ,  H01L23/49 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

摘要： Electromagnetic interference shielding is described for a semiconductor package using bond wires. In one example, a package has a substrate having a ground plane and a top side to carry a microelectronic die, the top side further having a conductive pad coupled to the ground plane, a microelectronic die having a bottom side attached to the substrate and a top side opposite the bottom side, and a plurality of bond wires connected to the top conductive pad to form a wire mesh electromagnetic interference shield for the substrate.

公开(公告)号：US20190267337A1

公开(公告)日：2019-08-29

申请号：US16348698

申请日：2016-12-29

申请人： Intel Corporation

发明人： Vijay K. NAIR ,  Digvijay Ashokkumar RAORANE

IPC分类号： H01L23/66 ,  H01L23/48 ,  H01L23/538 ,  H01P3/12 ,  H01P11/00

摘要： An integrated circuit (IC) comprises a substrate, a first die mounted on the substrate, a second die mounted on the substrate and a waveguide structure mounted on the first die and the second die to enable high frequency wireless communication between the first die and the second die.

公开(公告)号：US20180240762A1

公开(公告)日：2018-08-23

申请号：US15773033

申请日：2015-12-22

申请人： Intel Corporation

发明人： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Javier A. FALCON ,  Shawna M. LIFF ,  Yoshihiro TOMITA

IPC分类号： H01L23/66 ,  H01L25/16 ,  H01L23/498

CPC分类号： H01L23/66 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/00 ,  H01L25/16 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104

摘要： Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20200219830A1

公开(公告)日：2020-07-09

申请号：US16714502

申请日：2019-12-13

申请人： Intel Corporation

发明人： Vijay K. NAIR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING

IPC分类号： H01L23/66 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L23/64 ,  H01Q1/38

摘要： Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.

公开(公告)号：US20190019764A1

公开(公告)日：2019-01-17

申请号：US16069377

申请日：2016-03-31

申请人： Intel Corporation

发明人： Vijay K. NAIR ,  Digvijay RAORANE

IPC分类号： H01L23/552 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L21/82

摘要： A semiconductor package is described herein with electromagnetic shielding using metal layers and vias. In one example, the package includes a silicon substrate having a front side and a back side, the front side including active circuitry and an array of contacts to attach to a substrate, a metallization layer over the back side of the die to shield active circuitry from interference through the back side, and a plurality of through-silicon vias coupled to the back side metallization at one end and to front side lands of the array of lands at the other end to shield active circuitry from interference through the sides of the die.

公开(公告)号：US20180342472A1

公开(公告)日：2018-11-29

申请号：US15771982

申请日：2015-12-22

申请人： Intel Corporation

发明人： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Javier A. FALCON ,  Yoshihiro TOMITA ,  Vijay K. NAIR

IPC分类号： H01L23/66 ,  H01L23/00 ,  H01L25/18

摘要： Embodiments of the invention include a microelectronic device that includes a first die formed with a silicon based substrate and a second die coupled to the first die. The second die is formed with compound semiconductor materials in a different substrate (e.g., compound semiconductor substrate, group III-V substrate). An antenna unit is coupled to the second die. The antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20180301435A1

公开(公告)日：2018-10-18

申请号：US16015052

申请日：2018-06-21

申请人： Intel Corporation

发明人： Chuan HU ,  Vijay K. NAIR

IPC分类号： H01L23/00 ,  H01L25/03 ,  H01L21/56 ,  H01L21/768 ,  H01L25/16 ,  H01L21/78

摘要： In one embodiment of the invention, a system in package (SiP) is described which includes a plurality of device components with different form factors embedded within a molding compound layer. A surface for each of the device components is coplanar with a surface of the molding compound layer, and a single redistribution layer (RDL) formed on the coplanar surfaces of the molding compound layer and the plurality of device components. An active device die is electrically bonded to the single RDL directly vertically adjacent the plurality of device components. In an embodiment, the SiP is electrically connected to a circuit board with the active device die between the single RDL and the circuit board. In an embodiment, the SiP is electrically connected to a circuit board with the active device die over the single RDL and the circuit board.

公开(公告)号：US20170288635A1

公开(公告)日：2017-10-05

申请号：US15088814

申请日：2016-04-01

申请人： Intel Corporation

发明人： Adel A. ELSHERBINI ,  Feras EID ,  Baris BICEN ,  Telesphor KAMGAING ,  Vijay K. NAIR ,  Johanna M. SWAN ,  Georgios C. DOGIAMIS ,  Valluri R. RAO

IPC分类号： H03H9/02 ,  H03H9/17

CPC分类号： H03H9/02259 ,  H03H9/17 ,  H03H9/2463 ,  H03H2009/02291 ,  H03H2009/155

摘要： Embodiments of the invention include a piezoelectric resonator which includes an input transducer having a first piezoelectric material, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure. In one example, the vibrating structure is positioned above a cavity of an organic substrate. The output transducer includes a second piezoelectric material. In operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.