- 专利标题: SUBSTRATE PROCESSING APPARATUS
-
申请号: US15475335申请日: 2017-03-31
-
公开(公告)号: US20170291274A1公开(公告)日: 2017-10-12
- 发明人: Hiroyuki Shinozaki , Shuichi Kamata , Koichi Takeda , Ryuichi Kosuge
- 申请人: Ebara Corporation
- 优先权: JP2016-076569 20160406
- 主分类号: B24B37/005
- IPC分类号: B24B37/005 ; B24B37/30 ; B24B37/20
摘要:
The present disclosure provides a substrate processing apparatus including: a substrate holding unit that holds a substrate; a pressure regulator that regulates a pressure of a gas supplied into an elastic membrane; and a controller that controls the pressure regulator to make the pressure of the gas supplied into the elastic membrane variable in order to separate the substrate from the elastic membrane.
公开/授权文献
- US10926374B2 Substrate processing apparatus 公开/授权日:2021-02-23
信息查询