Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US15095484Application Date: 2016-04-11
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Publication No.: US20170294540A1Publication Date: 2017-10-12
- Inventor: I-Cheng Hu , Kai-Hsiang Wang , Tien-I Wu , Yu-Shu Lin , Shu-Yen Chan
- Applicant: UNITED MICROELECTRONICS CORP.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L29/40 ; H01L29/49 ; H01L29/161 ; H01L29/66 ; H01L29/45

Abstract:
A semiconductor structure and a method for manufacturing the same are provided. The semiconductor includes a substrate, two source/drain regions, a gate structure and two salicide layers. The two source/drain regions are partially disposed in the substrate each with a substantially flat top surface higher than a top surface of the substrate, and the two source/drain regions are separated from each other. The two source/drain regions are formed of an epitaxial material. The gate structure is disposed on the substrate between the two source/drain regions. The two salicide layers are disposed on the substantially flat top surfaces of the two source/drain regions, respectively.
Information query
IPC分类: