The present invention relates to a polishing pad comprising a polishing surface. The polishing surface comprises a first polishing area and a second polishing area. The first polishing area comprises a plurality of first foaming holes, and the second polishing area comprises a plurality of second foaming holes, and an average pore diameter of the first foaming holes is less than an average pore diameter of the second foaming holes. The polishing pad according to the present invention uses the polishing areas with the different pore diameters of the holes to avoid unevenly removing the edge and central part of a substrate when polishing, so that a thickness of the substrate becomes uniform.