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    POLISHING PAD, POLISHING APPARATUS, AND METHOD FOR MAKING THE POLISHING PAD
    1.
    发明申请
    POLISHING PAD, POLISHING APPARATUS, AND METHOD FOR MAKING THE POLISHING PAD 审中-公开
    抛光垫，抛光装置以及制造抛光垫的方法

    公开(公告)号：US20140110058A1

    公开(公告)日：2014-04-24

    申请号：US14056709

    申请日：2013-10-17

    申请人： SAN FANG CHEMICAL INDUSTRY CO., LTD.

    发明人： CHUNG-CHIH FENG ,  I-PENG YAO ,  YUNG-CHANG HUNG ,  KUN-CHENG TSAI

    IPC分类号： B24B37/20 ,  B29D7/00

    CPC分类号： B24B37/26 ,  B24B37/20 ,  B24D18/0009 ,  B29D7/00

    摘要： The present invention relates to a polishing pad comprising a polishing surface. The polishing surface comprises a first polishing area and a second polishing area. The first polishing area comprises a plurality of first foaming holes, and the second polishing area comprises a plurality of second foaming holes, and an average pore diameter of the first foaming holes is less than an average pore diameter of the second foaming holes. The polishing pad according to the present invention uses the polishing areas with the different pore diameters of the holes to avoid unevenly removing the edge and central part of a substrate when polishing, so that a thickness of the substrate becomes uniform.

    摘要翻译： 本发明涉及一种包括抛光表面的抛光垫。 抛光表面包括第一抛光区域和第二抛光区域。 第一研磨区域包括多个第一发泡孔，第二抛光区域包括多个第二发泡孔，第一发泡孔的平均孔径小于第二发泡孔的平均孔径。 根据本发明的抛光垫使用具有不同孔径的抛光区域，以避免抛光时不均匀地去除基板的边缘和中心部分，使得基板的厚度变得均匀。