- 专利标题： ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
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申请号： US15667738申请日： 2017-08-03
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公开(公告)号： US20170330814A1公开(公告)日： 2017-11-16
- 发明人: Seung On KANG , Woo Sung HAN , Young Gwan KO , Chul Kyu KIM , Han KIM
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2015-0065507 20150511; KR10-2015-0131398 20150917
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/498 ; H01L21/56 ; H01L23/522 ; H01L21/48
摘要：
An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.
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