- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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申请号: US15599040申请日: 2017-05-18
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公开(公告)号: US20170338256A1公开(公告)日: 2017-11-23
- 发明人: Masao OKIHARA
- 申请人: LAPIS Semiconductor Co., Ltd.
- 申请人地址: JP Yokohama
- 专利权人: LAPIS Semiconductor Co., Ltd.
- 当前专利权人: LAPIS Semiconductor Co., Ltd.
- 当前专利权人地址: JP Yokohama
- 优先权: JP2016-100782 20160519
- 主分类号: H01L27/144
- IPC分类号: H01L27/144 ; H01L31/0216 ; H01L31/103
摘要:
A semiconductor device includes first and second photo-electric conversion elements, each having a light-receiving surface, disposed adjacent to each other, each outputting a light current that is a current corresponding to an intensity of received light, a first filter disposed on the light-receiving surface of the first photo-electric conversion element, a second filter disposed on the light-receiving surface of the second photo-electric conversion element, and a third filter disposed on the light-receiving surface of the second photo-electric conversion element and being in contact with the second filter, one end of the second filter and one end of the third filter overlapping one end of the first filter at a vicinity of a boundary between the first photo-electric conversion element and the second photo-electric conversion element.
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