Invention Application
- Patent Title: STACKED FILM, ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF FABRICATING STACKED FILM
-
Application No.: US15599981Application Date: 2017-05-19
-
Publication No.: US20170345992A1Publication Date: 2017-11-30
- Inventor: Takao NOGUCHI
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2016-103584 20160524
- Main IPC: H01L41/08
- IPC: H01L41/08 ; H01L41/083 ; H01L41/047 ; H01L41/27 ; H01L41/18 ; H01H57/00

Abstract:
A stacked film includes an oxide film including a ZrO2 film, a metal oxide film provided on the oxide film, and a predetermined metal film provided on the metal oxide film and having a single orientation, and the metal oxide film is a PtO film or a PdO film. In the case of this structure, the predetermined metal film has a single orientation, and characteristics of the piezoelectric film such as PZT formed on the predetermined metal film are improved. Therefore, excellent characteristics such as an increase in the driving force due to the piezoelectric film or a reduction in leakage current can be exhibited.
Public/Granted literature
- US10608162B2 Stacked film, electronic device substrate, electronic device, and method of fabricating stacked film Public/Granted day:2020-03-31
Information query
IPC分类: