Invention Application
- Patent Title: Organic Silicone Resin Composition and Pre-preg, Laminate, Copper-clad Laminate, and Aluminum Substrate that Use the Composition
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Application No.: US15539467Application Date: 2015-06-01
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Publication No.: US20170349750A1Publication Date: 2017-12-07
- Inventor: Suwen YE , Guofang TANG
- Applicant: SHENGYI TECHNOLOGY CO., LTD.
- Priority: CN201410829549.1 20141225
- International Application: PCT/CN2015/080474 WO 20150601
- Main IPC: C08L83/06
- IPC: C08L83/06 ; C08G77/08 ; H05K1/03 ; C08J5/24 ; B32B38/08 ; C08K3/00 ; C08G77/00

Abstract:
The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufacturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.
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