Invention Application
- Patent Title: CONTACT FORMATION ON GERMANIUM-CONTAINING SUBSTRATES USING HYDROGENATED SILICON
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Application No.: US15175694Application Date: 2016-06-07
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Publication No.: US20170352738A1Publication Date: 2017-12-07
- Inventor: Karthik Balakrishnan , Pouya Hashemi , Bahman Hekmatshoartabari , Alexander Reznicek
- Applicant: International Business Machines Corporation
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/24 ; H01L21/3065 ; H01L21/02 ; H01L21/30 ; H01L21/28 ; H01L29/40 ; H01L29/16

Abstract:
A method and structure is provided in which germanium or a germanium tin alloy can be used as a channel material in either planar or non-planar architectures, with a functional gate structure formed utilizing either a gate first or gate last process. After formation of the functional gate structure, and contact openings within a middle-of-the-line (MOL) dielectric material, a hydrogenated silicon layer is formed that includes hydrogenated crystalline silicon regions disposed over the germanium or a germanium tin alloy, and hydrogenated amorphous silicon regions disposed over dielectric material. The hydrogenated amorphous silicon regions can be removed selective to the hydrogenated crystalline silicon regions, and thereafter a contact structure is formed on the hydrogenated crystalline silicon regions.
Public/Granted literature
- US10079288B2 Contact formation on germanium-containing substrates using hydrogenated silicon Public/Granted day:2018-09-18
Information query
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