A power module includes a multilayer circuit board, and first and second three-phase inverters, which are mounted on the multilayer circuit board to be stacked each other. A positive-electrode-side power source conductive trace of the first three-phase inverter and a negative-electrode-side power source conductive trace of the second three-phase inverter are disposed to at least partially face each other in a stacking direction of the multilayer circuit board, such that currents respectively flow through the power source conductive traces in opposite directions in a facing section. A negative-electrode-side power source conductive trace of the first three-phase inverter and a positive-electrode-side power source conductive trace of the second three-phase inverter are disposed to at least partially face each other in the stacking direction of the multilayer circuit board), such that currents respectively flow through the power source conductive traces in opposite directions in a facing section.