Invention Application
- Patent Title: Semiconductor Device and Method of Fabricating the Same
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Application No.: US15669280Application Date: 2017-08-04
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Publication No.: US20170358519A1Publication Date: 2017-12-14
- Inventor: Jin-Nam Kim , Tsukasa Matsuda , Rak-Hwan Kim , Byung-Hee Kim , Nae-In Lee , Jong-Jin Lee
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2014-0151278 20141113
- Main IPC: H01L23/485
- IPC: H01L23/485 ; H01L23/498 ; H01L21/768 ; H01L23/532 ; H01L23/522

Abstract:
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a first interlayer insulating layer including a first trench, on a substrate a first liner layer formed along a side wall and a bottom surface of the first trench and including noble metal, the noble metal belonging to one of a fifth period and a sixth period of a periodic chart that follows numbering of International Union of Pure and Applied Chemistry (IUPAC) and belonging to one of eighth to tenth groups of the periodic chart, and a first metal wire filling the first trench on the first liner layer, a top surface of the first metal wire having a convex shape toward a bottom suffice of the first trench.
Information query
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