Invention Application
- Patent Title: WAFER LEVEL OPTICS FOR FOLDED OPTIC PASSIVE DEPTH SENSING SYSTEM
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Application No.: US15484609Application Date: 2017-04-11
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Publication No.: US20170359568A1Publication Date: 2017-12-14
- Inventor: Todor Georgiev Georgiev , Zheng-wu Li , Wen-Yu Sun
- Applicant: QUALCOMM Incorporated
- Main IPC: H04N13/02
- IPC: H04N13/02 ; G02B13/00 ; H01L27/146 ; G02B13/04 ; G02B27/00

Abstract:
Certain aspects relate to wafer level optical designs for a folded optic stereoscopic imaging system. One example folded optical path includes first and second reflective surfaces defining first, second, and third optical axes, and where the first reflective surface redirects light from the first optical axis to the second optical axis and where the second reflective surface redirects light from the second optical axis to the third optical axis. Such an example folded optical path further includes wafer-level optical stacks providing ten lens surfaces distributed along the first and second optical axes. A variation on the example folded optical path includes a prism having the first reflective surface, wherein plastic lenses are formed in or secured to the input and output surfaces of the prism in place of two of the wafer-level optical stacks.
Public/Granted literature
- US09967547B2 Wafer level optics for folded optic passive depth sensing system Public/Granted day:2018-05-08
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