公开(公告)号：US09967547B2

公开(公告)日：2018-05-08

申请号：US15484609

申请日：2017-04-11

Applicant: QUALCOMM Incorporated

Inventor： Todor Georgiev Georgiev ,  Zheng-wu Li ,  Wen-Yu Sun

IPC: H04N13/02 ,  G02B13/04 ,  G02B27/00 ,  H01L27/146 ,  G02B27/22 ,  H01L49/00 ,  G02B13/00 ,  H04N5/225 ,  H04N5/378

CPC classification number: H04N13/279 ,  G02B13/0065 ,  G02B13/0085 ,  G02B13/04 ,  G02B27/0025 ,  G02B27/22 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/1464 ,  H01L49/00 ,  H04N5/2254 ,  H04N5/378 ,  H04N13/218 ,  H04N13/271

Abstract: Certain aspects relate to wafer level optical designs for a folded optic stereoscopic imaging system. One example folded optical path includes first and second reflective surfaces defining first, second, and third optical axes, and where the first reflective surface redirects light from the first optical axis to the second optical axis and where the second reflective surface redirects light from the second optical axis to the third optical axis. Such an example folded optical path further includes wafer-level optical stacks providing ten lens surfaces distributed along the first and second optical axes. A variation on the example folded optical path includes a prism having the first reflective surface, wherein plastic lenses are formed in or secured to the input and output surfaces of the prism in place of two of the wafer-level optical stacks.

公开(公告)号：US09986223B2

公开(公告)日：2018-05-29

申请号：US15484637

申请日：2017-04-11

Applicant: QUALCOMM Incorporated

Inventor： Sergiu Radu Goma ,  Todor Georgiev Georgiev ,  Biay-Cheng Hseih ,  Zheng-wu Li ,  Wen-Yu Sun

IPC: H04N13/02 ,  G02B13/02 ,  G02B17/08 ,  G03B35/10 ,  G02B3/00 ,  H04N5/374 ,  H04N5/376 ,  H04N5/378 ,  G02B27/22 ,  H01L49/00 ,  H04N5/225

CPC classification number: H04N13/218 ,  G02B3/0043 ,  G02B13/02 ,  G02B17/0856 ,  G02B27/22 ,  G03B35/10 ,  H01L49/00 ,  H04N5/2254 ,  H04N5/374 ,  H04N5/3765 ,  H04N5/378 ,  H04N13/271 ,  H04N2213/001

Abstract: Certain aspects relate to systems and techniques for folded optic stereoscopic imaging, wherein a number of folded optic paths each direct a different one of a corresponding number of stereoscopic images toward a portion of a single image sensor. Each folded optic path can include a set of optics including a first light folding surface positioned to receive light propagating from a scene along a first optical axis and redirect the light along a second optical axis, a second light folding surface positioned to redirect the light from the second optical axis to a third optical axis, and lens elements positioned along at least the first and second optical axes and including a first subset having telescopic optical characteristics and a second subset lengthening the optical path length. The sensor can be a three-dimensionally stacked backside illuminated sensor wafer and reconfigurable instruction cell array processing wafer that performs depth processing.

公开(公告)号：US20170359566A1

公开(公告)日：2017-12-14

申请号：US15484637

申请日：2017-04-11

Applicant: QUALCOMM Incorporated

Inventor： Sergiu Radu Goma ,  Todor Georgiev Georgiev ,  Biay-Cheng Hseih ,  Zheng-wu Li ,  Wen-Yu Sun

IPC: H04N13/02 ,  H04N5/374 ,  G02B17/08 ,  H04N5/376 ,  G02B13/02 ,  G03B35/10 ,  H04N5/378 ,  G02B3/00

CPC classification number: H04N13/218 ,  G02B3/0043 ,  G02B13/02 ,  G02B17/0856 ,  G02B27/22 ,  G03B35/10 ,  H01L49/00 ,  H04N5/2254 ,  H04N5/374 ,  H04N5/3765 ,  H04N5/378 ,  H04N13/271 ,  H04N2213/001

Abstract: Certain aspects relate to systems and techniques for folded optic stereoscopic imaging, wherein a number of folded optic paths each direct a different one of a corresponding number of stereoscopic images toward a portion of a single image sensor. Each folded optic path can include a set of optics including a first light folding surface positioned to receive light propagating from a scene along a first optical axis and redirect the light along a second optical axis, a second light folding surface positioned to redirect the light from the second optical axis to a third optical axis, and lens elements positioned along at least the first and second optical axes and including a first subset having telescopic optical characteristics and a second subset lengthening the optical path length. The sensor can be a three-dimensionally stacked backside illuminated sensor wafer and reconfigurable instruction cell array processing wafer that performs depth processing.

公开(公告)号：US10394004B2

公开(公告)日：2019-08-27

申请号：US15275148

申请日：2016-09-23

Applicant: QUALCOMM Incorporated

Inventor： Todor Georgiev Georgiev ,  Wen-Yu Sun ,  Zheng-wu Li ,  Jon Lasiter

IPC: G02B27/10 ,  G02B13/00 ,  B32B37/12 ,  G02B5/00 ,  G02B27/00

Abstract: An optical system may include a lens assembly that has two or more single-sided wafer level optics (WLO) lenses arranged to propagate light. The optical system can further include an image sensor, wherein the lens assembly is arranged relative to the image sensor to propagate light received at a first surface of the lens assembly, through the two or more single-sided WLO lenses and to the image sensor. In some embodiments, the optical system further includes a camera which includes the lens assembly and the image sensor. In various embodiments, a smart phone, a tablet computer, or another mobile computing device may include such a camera. In some embodiments, the at least two single-sided wafer level optics (WLO) lenses are each separated by a gap G, wherein the gap may be different between each of the single-sided lenses, and the gap G may be zero.

公开(公告)号：US20170359568A1

公开(公告)日：2017-12-14

申请号：US15484609

申请日：2017-04-11

Applicant: QUALCOMM Incorporated

Inventor： Todor Georgiev Georgiev ,  Zheng-wu Li ,  Wen-Yu Sun

IPC: H04N13/02 ,  G02B13/00 ,  H01L27/146 ,  G02B13/04 ,  G02B27/00

CPC classification number: H04N13/279 ,  G02B13/0065 ,  G02B13/0085 ,  G02B13/04 ,  G02B27/0025 ,  G02B27/22 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/1464 ,  H01L49/00 ,  H04N5/2254 ,  H04N5/378 ,  H04N13/218 ,  H04N13/271

Abstract: Certain aspects relate to wafer level optical designs for a folded optic stereoscopic imaging system. One example folded optical path includes first and second reflective surfaces defining first, second, and third optical axes, and where the first reflective surface redirects light from the first optical axis to the second optical axis and where the second reflective surface redirects light from the second optical axis to the third optical axis. Such an example folded optical path further includes wafer-level optical stacks providing ten lens surfaces distributed along the first and second optical axes. A variation on the example folded optical path includes a prism having the first reflective surface, wherein plastic lenses are formed in or secured to the input and output surfaces of the prism in place of two of the wafer-level optical stacks.

公开(公告)号：US20170285308A1

公开(公告)日：2017-10-05

申请号：US15275148

申请日：2016-09-23

Applicant: QUALCOMM Incorporated

Inventor： Todor Georgiev Georgiev ,  Wen-Yu Sun ,  Zheng-wu Li ,  Jon Lasiter

IPC: G02B13/00 ,  B32B37/12

CPC classification number: G02B13/0085 ,  B32B37/12 ,  B32B2307/40 ,  G02B5/005 ,  G02B13/0045 ,  G02B27/0025

Abstract: An optical system may include a lens assembly that has two or more single-sided wafer level optics (WLO) lenses arranged to propagate light. The optical system can further include an image sensor, wherein the lens assembly is arranged relative to the image sensor to propagate light received at a first surface of the lens assembly, through the two or more single-sided WLO lenses and to the image sensor. In some embodiments, the optical system further includes a camera which includes the lens assembly and the image sensor. In various embodiments, a smart phone, a tablet computer, or another mobile computing device may include such a camera. In some embodiments, the at least two single-sided wafer level optics (WLO) lenses are each separated by a gap G, wherein the gap may be different between each of the single-sided lenses, and the gap G may be zero.