- 专利标题： ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECTRONIC PART EMBEDDED SUBSTRATE
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申请号： US15676288申请日： 2017-08-14
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公开(公告)号： US20170365559A1公开(公告)日： 2017-12-21
- 发明人: Takaharu YAMANO , Hajime IIZUKA , Hideaki SAKAGUCHI , Toshio KOBAYASHI , Tadashi ARAI , Tsuyoshi KOBAYASHI , Tetsuya KOYAMA , Kiyoaki IIDA , Tomoaki MASHIMA , Koichi TANAKA , Yuji KUNIMOTO , Takashi YANAGISAWA
- 申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 优先权： JP2005-360519 20051214; JP2006-117618 20060421
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/48 ; H01L25/16 ; H01L25/10 ; H01L23/00 ; H01L23/31 ; H01L21/683 ; H01L21/56 ; H05K1/18 ; H01L23/552 ; H01L23/498 ; H05K3/46 ; H05K3/20
摘要：
An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.
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