公开(公告)号：US20170365559A1

公开(公告)日：2017-12-21

申请号：US15676288

申请日：2017-08-14

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Takaharu YAMANO ,  Hajime IIZUKA ,  Hideaki SAKAGUCHI ,  Toshio KOBAYASHI ,  Tadashi ARAI ,  Tsuyoshi KOBAYASHI ,  Tetsuya KOYAMA ,  Kiyoaki IIDA ,  Tomoaki MASHIMA ,  Koichi TANAKA ,  Yuji KUNIMOTO ,  Takashi YANAGISAWA

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L25/16 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/56 ,  H05K1/18 ,  H01L23/552 ,  H01L23/498 ,  H05K3/46 ,  H05K3/20

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

摘要： An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

公开(公告)号：US20140063764A1

公开(公告)日：2014-03-06

申请号：US13969814

申请日：2013-08-19

申请人： Shinko Electric Industries Co., Ltd.

发明人： Koichi TANAKA ,  Nobuyuki KURASHIMA ,  Hajime IIZUKA ,  Satoshi SHIRAKI

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/186 ,  H05K3/4015 ,  H05K3/4614 ,  H05K2203/061 ,  H01L2924/00

摘要： An electronic component incorporated substrate includes a first substrate and a second substrate that are electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. An encapsulating resin fills a space between the first substrate and the second substrate to encapsulate the electronic component. The spacer unit includes a stacked structure of a metal post and a solder ball stacked in a stacking direction of the first substrate and the second substrate. The spacer unit further includes an insulation layer that is formed on the second substrate and covers a side wall of the metal post.

摘要翻译： 电子元件结合基板包括通过间隔单元彼此电连接的第一基板和第二基板。 电子部件安装在第一基板上并且布置在第一基板和第二基板之间。 封装树脂填充第一基板和第二基板之间的空间以封装电子部件。 间隔单元包括层叠在第一基板和第二基板的堆叠方向上的金属柱和焊球的堆叠结构。 间隔单元还包括形成在第二基板上并覆盖金属柱的侧壁的绝缘层。

公开(公告)号：US20140313681A1

公开(公告)日：2014-10-23

申请号：US14321030

申请日：2014-07-01

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Takaharu YAMANO ,  Hajime IIZUKA ,  Hideaki SAKAGUCHI ,  Toshio KOBAYASHI ,  Tadashi ARAI ,  Tsuyoshi KOBAYASHI ,  Tetsuya KOYAMA ,  Kiyoaki IIDA ,  Tomoaki MASHIMA ,  Koichi TANAKA ,  Yuji KUNIMOTO ,  Takashi YANAGISAWA

IPC分类号： H05K1/18

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

摘要： An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

摘要翻译： 公开了一种电子部件嵌入式基板。 电子部件嵌入式基板包括第一基板，第二基板，电子部件，电连接部件和密封部件。 还公开了一种制造电子部件嵌入式基板的方法。 该方法包括将电子部件安装到第一基板上，通过电连接部件将第二基板层压在第一基板上; 以及用密封构件填充第一基板和第二基板之间的空间以密封电子部件。

公开(公告)号：US20140054773A1

公开(公告)日：2014-02-27

申请号：US13944188

申请日：2013-07-17

申请人： Shinko Electric Industries Co., Ltd.

发明人： Nobuyuki KURASHIMA ,  Tetsuya KOYAMA ,  Hajime IIZUKA ,  Koichi TANAKA

IPC分类号： H01L23/28 ,  H01L23/498

CPC分类号： H01L23/28 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/14 ,  H05K1/186 ,  H05K3/284 ,  H05K3/462 ,  H05K3/4697 ,  H05K2201/10234 ,  H05K2203/1327 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic component built-in substrate, includes a lower wiring substrate, an electronic component mounted on the lower wiring substrate, an intermediate wiring substrate including an opening portion in which the electronic component is mounted, and arranged in a periphery of the electronic component, and connected to the lower wiring substrate via a first conductive ball, an upper wiring substrate arranged over the electronic component and the intermediate wiring substrate, and connected to the intermediate wiring substrate via a second conductive ball, and a resin filled into respective areas between the lower wiring substrate, the intermediate wiring substrate, and the upper wiring substrate, and sealing the electronic component, wherein the first conductive ball and the second conductive ball are arranged in displaced positions mutually.

摘要翻译： 电子部件内置基板包括下布线基板，安装在下布线基板上的电子部件，包括安装有电子部件的开口部并配置在电子部件的周围的中间布线基板， 并且经由第一导电球，布置在电子部件上的上部布线基板和中间布线基板连接到下部布线基板，并且经由第二导电球与中间布线基板连接，并且将树脂填充到第二导电球之间的各个区域中 下布线基板，中间布线基板和上布线基板，并且密封电子部件，其中第一导电球和第二导电球相互布置在位移​​位置。

公开(公告)号：US20170221829A1

公开(公告)日：2017-08-03

申请号：US15409766

申请日：2017-01-19

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Satoshi SHIRAKI ,  Koichi TANAKA

IPC分类号： H01L23/538 ,  H01L21/56 ,  H01L21/48 ,  H05K1/14 ,  H01L23/31

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3142 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/042 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic component integrated substrate includes a first substrate including a first pad, a first solder resist layer provided with a first open portion that selectively exposes the first pad, and a connection pad formed on the first solder resist layer, and electrically connected to the first pad; a second substrate, stacked on the first substrate, including a second pad, and a second solder resist layer formed on the second pad and provided with a second open portion that selectively exposes the second pad; an electronic component mounted on the first substrate and sandwiched between the first substrate and the second substrate; and a substrate connection member that electrically connects the connection pad and the second pad with each other, the diameter of the connection pad being larger than each of the diameter of the first pad and the diameter of the second open portion.

公开(公告)号：US20160358858A1

公开(公告)日：2016-12-08

申请号：US15241482

申请日：2016-08-19

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Takaharu YAMANO ,  Hajime IIZUKA ,  Hideaki SAKAGUCHI ,  Toshio KOBAYASHI ,  Tadashi ARAI ,  Tsuyoshi KOBAYASHI ,  Tetsuya KOYAMA ,  Kiyoaki IIDA ,  Tomoaki MASHIMA ,  Koichi TANAKA ,  Yuji KUNIMOTO ,  Takashi YANAGISAWA

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

摘要： An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

摘要翻译： 公开了一种电子部件嵌入式基板。 电子部件嵌入式基板包括第一基板，第二基板，电子部件，电连接部件和密封部件。 还公开了一种制造电子部件嵌入式基板的方法。 该方法包括将电子部件安装到第一基板上，通过电连接部件将第二基板层压在第一基板上; 以及用密封构件填充第一基板和第二基板之间的空间以密封电子部件。

公开(公告)号：US20140210109A1

公开(公告)日：2014-07-31

申请号：US14150952

申请日：2014-01-09

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Koichi TANAKA ,  Nobuyuki KURASHIMA ,  Hajime IIZUKA ,  Satoshi SHIRAKI

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/52

CPC分类号： H01L21/56 ,  H01L21/52 ,  H01L21/563 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A built-in electronic component substrate includes a first substrate, an electronic component including side surfaces and mounted on the first substrate, a first resin provided on the first substrate and covering the side surfaces of the electronic component, a second substrate provided above the electronic component and the first resin and layered on the first substrate, a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates, a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate, and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin.

摘要翻译： 内置的电子元件基板包括第一基板，包括侧表面并安装在第一基板上的电子部件，设置在第一基板上并覆盖电子部件的侧表面的第一树脂，设置在电子元件上方的第二基板 所述第一树脂和所述第一树脂层叠在所述第一基板上，基板连接构件，设置在所述第一基板和所述第二基板之间并电连接所述第一基板和所述第二基板;第二树脂，填充在所述电子部件和所述第二基板之间， 第一树脂和第二基板，以及填充在第一和第二基板之间并封装基板连接构件，电子部件，第一树脂和第二树脂的第三树脂。