- 专利标题: HEAT CONDUCTIVE PASTE AND METHOD FOR PRODUCING THE SAME
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申请号: US15548614申请日: 2016-02-01
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公开(公告)号: US20180002576A1公开(公告)日: 2018-01-04
- 发明人: Koji SASAKI , Hiroki MARUYAMA
- 申请人: NAMICS CORPORATION
- 申请人地址: JP Niigata-shi, Niigata
- 专利权人: NAMICS CORPORATION
- 当前专利权人: NAMICS CORPORATION
- 当前专利权人地址: JP Niigata-shi, Niigata
- 优先权: JP2015-020219 20150204
- 国际申请: PCT/JP2016/052900 WO 20160201
- 主分类号: C09J9/02
- IPC分类号: C09J9/02 ; C09J11/06 ; C09J1/00 ; H01L21/52 ; H01B1/22
摘要:
A heat conductive paste including silver fine particles having an average particle diameter of primary particles of 40 to 350 nm, a crystallite diameter of 20 to 70 nm, and a ratio of the average particle diameter to the crystallite diameter of 1 to 5, an aliphatic primary amine and a compound having at least one phosphoric acid group. The heat conductive paste includes 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group based on 100 parts by mass of the silver fine particles. The heat conductive paste has a high conductivity.
公开/授权文献
- US10544334B2 Heat conductive paste and method for producing the same 公开/授权日:2020-01-28