• 专利标题: METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHODS FOR CHECKING FOR ADEQUATE CLEARANCE BETWEEN ADJACENT WIRE LOOPS
  • 申请号: US15623978
    申请日: 2017-06-15
  • 公开(公告)号: US20180005980A1
    公开(公告)日: 2018-01-04
  • 发明人: Basil MiltonWei Qin
  • 申请人: Kulicke and Soffa Industries, Inc.
  • 主分类号: H01L23/00
  • IPC分类号: H01L23/00
METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHODS FOR CHECKING FOR ADEQUATE CLEARANCE BETWEEN ADJACENT WIRE LOOPS
摘要:
A method of generating a wire loop profile in connection with a semiconductor package is provided. The method includes the steps of: (a) providing package data related to the semiconductor package; and (b) creating a loop profile of a wire loop of the semiconductor package, the loop profile including a tolerance band along at least a portion of a length of the wire loop.
信息查询
0/0