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公开(公告)号：US11935864B2
公开(公告)日：2024-03-19
申请号：US17971722
申请日：2022-10-24
发明人： Hui Xu , JeongHo Yang , Wei Qin , Ziauddin Ahmad
CPC分类号： H01L24/78 , B23K20/004 , H01L24/85 , H01L2224/7892 , H01L2224/78984
摘要： A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
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公开(公告)号：US20230039460A1
公开(公告)日：2023-02-09
申请号：US17971722
申请日：2022-10-24
发明人： Hui Xu , JeongHo Yang , Wei Qin , Ziauddin Ahmad
摘要： A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
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公开(公告)号：US20190259730A1
公开(公告)日：2019-08-22
申请号：US16401511
申请日：2019-05-02
发明人： Basil Milton , Wei Qin
IPC分类号： H01L23/00 , H01L21/48 , H01L23/528
摘要： A method of generating a wire loop profile in connection with a semiconductor package is provided. The method includes the steps of: (a) providing package data related to the semiconductor package; and (b) creating a loop profile of a wire loop of the semiconductor package, the loop profile including a tolerance band along at least a portion of a length of the wire loop.
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公开(公告)号：US11865633B2
公开(公告)日：2024-01-09
申请号：US18104423
申请日：2023-02-01
发明人： Hui Xu , Wei Qin , D. Matthew Odhner
IPC分类号： B23K20/00 , B23K20/26 , B23K101/40 , H01L23/00
CPC分类号： B23K20/007 , B23K20/004 , B23K20/26 , B23K2101/40 , H01L24/85 , H01L2224/859 , H01L2224/85035
摘要： A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
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公开(公告)号：US20230154888A1
公开(公告)日：2023-05-18
申请号：US17987708
申请日：2022-11-15
发明人： Jon W. Brunner , Wei Qin , Aashish Shah , Hui Xu , Jeong Ho Yang
CPC分类号： H01L24/78 , H01L24/85 , B23K20/10 , H01L24/48 , H01L2224/48221 , H01L2924/386 , H01L2224/78001 , H01L2224/78343 , H01L2224/78901 , H01L2224/7892 , H01L2224/78925 , H01L2224/85986 , H01L2224/859 , H01L2224/85205 , B23K2101/40
摘要： A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
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公开(公告)号：US11597031B2
公开(公告)日：2023-03-07
申请号：US17517827
申请日：2021-11-03
发明人： Hui Xu , Wei Qin , D. Matthew Odhner
IPC分类号： B23K20/00 , B23K20/26 , B23K101/40 , H01L23/00
摘要： A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
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公开(公告)号：US10121759B2
公开(公告)日：2018-11-06
申请号：US15234563
申请日：2016-08-11
摘要： A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
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公开(公告)号：US20180005980A1
公开(公告)日：2018-01-04
申请号：US15623978
申请日：2017-06-15
发明人： Basil Milton , Wei Qin
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L21/48 , H01L24/05 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45014 , H01L2224/48091 , H01L2224/48095 , H01L2224/48463 , H01L2224/4847 , H01L2224/49052 , H01L2224/49111 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/85123 , H01L2224/85125 , H01L2224/85127 , H01L2224/85129 , H01L2224/859 , H01L2924/00014 , H01L2224/45099
摘要： A method of generating a wire loop profile in connection with a semiconductor package is provided. The method includes the steps of: (a) providing package data related to the semiconductor package; and (b) creating a loop profile of a wire loop of the semiconductor package, the loop profile including a tolerance band along at least a portion of a length of the wire loop.
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9.发明申请公开(公告)号：US20170125311A1
公开(公告)日：2017-05-04
申请号：US15234563
申请日：2016-08-11
CPC分类号： H01L24/78 , B23K20/005 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/92 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/78001 , H01L2224/78901 , H01L2224/85181 , H01L2224/859 , H01L2224/92247 , H01L2924/00014 , H01L2224/05599 , H01L2224/45099 , H01L2924/00 , H01L2224/85399
摘要： A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
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10.发明公开公开(公告)号：US20230335532A1
公开(公告)日：2023-10-19
申请号：US18125152
申请日：2023-03-23
发明人： Basil Milton , Wei Qin , Zhijie Wang , Vladimir Pribula , Pavel Shusharin
CPC分类号： H01L24/85 , H01L22/20 , H01L2224/859 , H01L2224/85181
摘要： A method of determining a height value of a wire loop on a wire bonding machine is provided. The method includes the steps of: (a) imaging at least a portion of a wire loop using an imaging system on a wire bonding machine to detect a path of the portion of the wire loop; (b) moving a wire bonding tool towards a first contact portion of the wire loop in the path; (c) detecting when a portion of a conductive wire engaged with the wire bonding tool contacts the first contact portion of the wire loop; and (d) determining a height value of the wire loop at the first contact portion based on a position of the wire bonding tool when the portion of the conductive wire contacts the first contact portion of the wire loop.
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