Invention Application
- Patent Title: PACKAGING WITH LAY-FLAT FLAPS
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Application No.: US15204255Application Date: 2016-07-07
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Publication No.: US20180009586A1Publication Date: 2018-01-11
- Inventor: Matthew MUNDT , Bartley K. ANDRE
- Applicant: Apple Inc.
- Main IPC: B65D75/14
- IPC: B65D75/14 ; B65D75/54 ; B65B7/20 ; B65D81/107 ; B65B5/04

Abstract:
A package for an item is disclosed. The package includes an outer box and a first insert panel. The outer box includes a base panel and a first flap extending from the base panel. The first flap is configured to open and close the package. The first insert panel is disposed within the outer box. The first insert panel has a first end attached to the first flap and a second end disposed over the base panel. The first insert panel is configured to support an item within the package. The first insert panel is configured to move relative to the base panel when the first flap is opened. The first insert panel is configured to keep the first flap in an open position by friction between the first insert panel and the base panel.
Public/Granted literature
- US10301046B2 Packaging with lay-flat flaps Public/Granted day:2019-05-28
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