A method for packaging a thermoelectric module may include thermoelectric module accommodation, of accommodating at least one thermoelectric module in a housing having a base and a sidewall, electric wire sealing, of sealing an electric wire of the thermoelectric module with a sealing tube, bonding member interposing, of placing a cover having a top portion and a sidewall on top of the housing and interposing a bonding member between the sidewall of the housing and the sidewall of the cover, and bonding, of bonding the sidewall of the housing and the sidewall of the cover that are hermetically sealed by the bonding member, in which the bonding member may be formed of a resin material.